With increasing heat densities in modern electronics, quite often the system packaging also becomes part of the thermal management solution for the system. In addition, the need to move electrical current within the system; or to the outside world also exists. Whether that current be signal level, transferred traditionally through printed circuit boards; or a much higher power level sent through cables or bus bars FUSION can help meet these needs through the Interconnect and Packaging products and technologies we represent.

  • Enclosures
  • PC Boards & Bus Bars
  • Interconnect Technologies
  • Custom Fabrication