Fusion Sourcing Group

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Packaging & Interconnect

With increasing heat densities in modern electronics, quite often the system packaging also becomes part of the thermal management solution for the system. In addition, the need to move electrical current within the system; or to the outside world also exists. Whether that current be signal level, transferred traditionally through printed circuit boards; or a much higher power level sent through cables or bus bars FUSION can help meet these needs through the Interconnect and Packaging products and technologies we represent.

Enclosures
PC Boards & Bus Bars
Interconnect Technologies
Custom Fabrication

Aimtron Corp.

Provides complete end-to-end PCB Design and Assembly Service Solutions from concept to end product. From small rapid-turn prototypes through high volume domestic and offshore capabilities, Aimtron will help you achieve your goals.

Anderson Power Products

International leader in high power interconnect solutions.

Aprios Custom Manufacturing

Custom micro-molder, plastic-injection molder and additive manufacturer of high-precision, close-tolerance parts.

Attend Technology

Leading provider of advanced connectivity solutions.

CviLux USA

Connectors, FFC, and wire harnesses primarily for the application of consumer electronics, computers, communication and electro-optical industry.

Mega Electronics

Provides one source for all components that bring power from the wall into your product, for any location, anywhere in the world.

Saturn Electronics

Designs and manufactures bare printed circuit boards (PCBs), providing multilayer PCBs, PCB heatsinks, copper buried vias, thermal management PCBs, blind/buried vias, edge plating PCBs, flexible bare circuit boards, PTFE hybrid PCBs, and MCPCBs for LED thermal management.

Packaging & Interconnect

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